Digital Realty Announces New Liquid-to-Chip Cooling Technology for High-Density Workloads

May 15, 2024

On May 15, 2024, Digital Realty, global provider of cloud- and carrier-neutral data center solutions, announced the availability of a new liquid-to-chip cooling technology. This innovation is designed to manage high-density workloads, particularly for artificial intelligence (AI) and data-intensive applications. The technology introduces direct liquid cooling (DLC), allowing businesses to deploy high-density configurations within a shared environment. The technology can manage power densities ranging from 30 to 150 kilowatts per rack and beyond. The solution is available in more than half of Digital Realty's data centers worldwide, with plans to expand support to additional sites.